Mobile Phone Spare Parts Supplier
Uncategorized

iPhone 13 Pro HD Teardown Exploded View

Disassemble screen   Internal structural has changed a lot from iPhone 12 Pro. Left side is iPhone 13 Pro, right side is iPhone 12 Pro. We can see A15 text,…

Disassemble screen

 

Internal structural has changed a lot from iPhone 12 Pro. Left side is iPhone 13 Pro, right side is iPhone 12 Pro. We can see A15 text, and text layout on the battery has changed.

Compared with 12 Pro, screen is no longer integrated with handset, which means it is easier to change the screen, but difficult to change the handset.

Remove the three cameras and radar

iPhone 13 Pro cameras are bigger than 12 Pro

Battery.

13 Pro is L-shaped battery, the same as 13 Pro Max.

Motherboard, SIM card slot is welded on motherboard, chips include:

Red: Apple APL1W07 A15 Bionic chip, 6GB SK Hynix LPDDR4X SDRAM

Orange: Apple/USI U1 ultra-wideband chip

Yellow: Apple APL 1098 power management IC

Green: Skyworks SKY58276-17 front-end module

Purple: Skyworks SKY58276-19 front-end module

Blue: Apple 338S00770-B0 power management IC

Pink: ST Microelectronics STB601A05 power management IC

iPhone 13 Pro continues dual-layer motherboard design, chips include

Red: 128GB Kioxia flash memory chip

Orange: Qualcomm SDX60M 5G modem

Orange: Qualcomm SDR868 5G RF transceiver

Green: USI 339S00761 Wi-Fi/Bluetooth module

Pink: Broadcom AFEM-8215 front-end module

Blue: NXP SN210V NFC controller

Earpiece on the top, and reduced face ID

Compared with face ID of iPhone 12 Pro, the length is 20% shorter.

Dismantling complete! Brand-new screen design, variable refresh rate, OLED and touch layer integration. The position of earpiece changed, it is easier to change the screen, and Apple bangs are made smaller. L-type battery returns.

 

Source:https://www.zuphp.com/990.html

Share article
Menu