iPhone 13 Pro HD Teardown Exploded View
Internal structural has changed a lot from iPhone 12 Pro. Left side is iPhone 13 Pro, right side is iPhone 12 Pro. We can see A15 text, and text layout on the battery has changed.
Compared with 12 Pro, screen is no longer integrated with handset, which means it is easier to change the screen, but difficult to change the handset.
Remove the three cameras and radar
iPhone 13 Pro cameras are bigger than 12 Pro
13 Pro is L-shaped battery, the same as 13 Pro Max.
Motherboard, SIM card slot is welded on motherboard, chips include:
Red: Apple APL1W07 A15 Bionic chip, 6GB SK Hynix LPDDR4X SDRAM
Orange: Apple/USI U1 ultra-wideband chip
Yellow: Apple APL 1098 power management IC
Green: Skyworks SKY58276-17 front-end module
Purple: Skyworks SKY58276-19 front-end module
Blue: Apple 338S00770-B0 power management IC
Pink: ST Microelectronics STB601A05 power management IC
iPhone 13 Pro continues dual-layer motherboard design, chips include
Red: 128GB Kioxia flash memory chip
Orange: Qualcomm SDX60M 5G modem
Orange: Qualcomm SDR868 5G RF transceiver
Green: USI 339S00761 Wi-Fi/Bluetooth module
Pink: Broadcom AFEM-8215 front-end module
Blue: NXP SN210V NFC controller
Earpiece on the top, and reduced face ID
Compared with face ID of iPhone 12 Pro, the length is 20% shorter.
Dismantling complete! Brand-new screen design, variable refresh rate, OLED and touch layer integration. The position of earpiece changed, it is easier to change the screen, and Apple bangs are made smaller. L-type battery returns.